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18.01.2025 2:56:24
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Access Point WBE750
 
NETGEAR WBE750: nadupaný výkon a nepřeko
POLOLU-4980
 
MINIATURNÍ STEP-UP/STEP-DOWN MĚNIČE FIRM
MANSON SDP-2210
 
PROGRAMOVATELNÝ LABORATORNÍ NAPÁJECÍ ZDR
DPI 750E
 
RS Components přidává řadu vylepšených i
BHI260AB
 
An All-in-One Programmable Smart Sensor
SMI200
 
Nový pohled na klasiku: Kompaktní HMI s
BAHCO
 
Sada izolovaných klíčů BAHCO
s-Sense
 
Moduly s-Sense firmy R&D SOFTWARE SOLUTI
LP-RF
 
Panasonic: LP-RF – cenově dostupné laser
TH381
 
Miniaturní těsné svorky řady TH381
Elektronické součástky


Murata introduces common mode noise filters for high-speed differential interfaces such as USB4
Murata Manufacturing Co., Ltd. has introduced the NFG0QHB_HS2 series of multilayer type common mode noise filters for high-speed differential interfaces (USB4, USB3.2 Gen1/2, HDMI2.1, etc.). Mass production of these products will start in May 2020.
Válcové elektromagnety řady 51M-STA
Válcové elektromagnety řady51M-STA zajišťují velkou sílu při malém zdvihu kotvy a vyznačují se dlouhou životností a spolehlivostí. Celá řada STA je navržená na základě systému nízkého tření mezi kotvou a kostrou cívky a zaručuje 25 milionů bezporuchových aktivací elektromagnetu. Elektromagnety STA jsou navíc odolné vůči otřesům a vibracím a mohou být tedy používány v extrémních podmínkách prostředí.
Murata introduces Mass Production of a FORTELION 24V Battery Module for Industrial Equipment
Murata Manufacturing Co., Ltd. has developed a FORTELION 24V Battery Module (all-in-one type) that is ideal for industrial equipment requiring high output such as automated guided vehicles (AGVs)*1 and robots.
Nexperia launches P-channel MOSFETs in robust, space-saving LFPAK56 package
Nexperia, the expert in essential semiconductors, has launched industry’s first family of P-channel MOSFETs in the robust, space-saving LFPAK56 (Power-SO8) package. AEC-Q101 qualified for automotive applications, the new devices are an ideal replacement for DPAK MOSFETs, offering a reduction in footprint of over 50% whilst maintaining high performance levels. The new products are available in 30 V – 60 V, with RDS(on) down to 10 mΩ (30 V)
120W 1/8th brick DC-DC converter with 9-36Vdc range for industrial applications
Murata Electronics today announced that it has expanded its UWE family of DC-DC converters by Murata Power Solutions to include the UWE-Q12 series. This new product offers greater design flexibility because of the 9-36Vin range, 120 Watt rating, high efficiency, and cost effectiveness that it delivers.
KEMET Introduces Metal Composite Power Inductors for Automotive Applications
METCOM™ for automotive offers high reliability and performance with best in class EMI shielding for low magnetic flux leakage
SFP28 High-Speed Connector for Data Networking Optical Transceiver Applications
Yamaichi Electronics offers the SFP28 host connector for a data transmission rate of 56 Gbps PAM-4 modulation per one channel.
Murata Begins Mass Production of World's Smallest PTC Thermistor Contributing to Improving the Safety of Multifunctional Smartphones and Small Wearables
New Functional Safety Ready AVR® DA Microcontroller Family Enables Real-Time Control, Connectivity and HMI Applications
Next-generation AVR MCU family features core independent peripherals, advanced analog and on-chip communications
Murata and Google team to develop world’s smallest AI module with Coral intelligence
Murata announces that it has created the world’s smallest artificial intelligence (AI) module in partnership with Google – the Coral Accelerator Module. The custom designed module packages Google’s Edge TPU ASIC within a miniaturized footprint.
Inductors: Compact dual inductors with high saturation current
TDK Corporation has extended its range of dual inductors to include the new EPCOS series B82477D6*. The seven series types cover an inductance range from 2 x 3.9 µH to 2 x 47 µH and are designed for maximum rated currents from 2.83 A to 7.05 A. A special feature of the inductors, which are certified according to AEC-Q200 and compatible with RoHS, are the high saturation currents of up to 16.1 A.
10th Gen Intel Core H-series Introduces the World’s Fastest Mobile Processor at 5.3 GHz
What’s New: Today, Intel breaks beyond the 5 GHz barrier for laptops with the launch of the 10th Gen Intel® Core™ H-series mobile processors. Headlined by the 10th Gen Intel Core i9-10980HK1 processor, the H-series delivers desktop-caliber performance that gamers and creators can take anywhere.
DINKLE BUS Housingsystem
In addition to the extremely compact housing widths of 12mm and 20mm DINKLE is now offering 40mm and 60mm versions for additional electronics installation space. The new standard widths offer sufficient space to accommodate capacitors, relays or other high electronic components on the PCB.
Ultra-tiny MOSFETs from Nexperia are 36% smaller with lowest RDS(on)
Nexperia has launched a range of MOSFETs in the ultra-small DFN0606 package for mobile and portable applications including wearables. The devices also offer the lowest RDS(on) for their size and employ the commonly used pitch of 0.35 mm to simplify PCB assembly processes.
An All-in-One Programmable Smart Sensor for Always-On Applications
For all those high-tech applications such as fitness tracking, step counting, indoor navigation and gesture recognition on your smart watch, smartphone or other mobile devices, all require ultra-low power, high performance smart sensors.
Power Integrations’ GaN Technology Increases Output Power of High-Efficiency Display PSUs to 75 W
Power Integrations announced that its InnoSwitch™3-MX isolated switcher IC family has been expanded with the addition of three new PowiGaN™ devices. As part of a chipset with Power Integrations’ InnoMux™ controller IC, the new switcher ICs now support display and appliance power supply applications with a continuous output power of up to 75 W without a heatsink.
AMD Expands 3rd Gen AMD Ryzen™ Desktop Processor Family, Unleashing Powerful “Zen 2” Core For The Mainstream
AMD announced the newest additions to the 3rd Gen AMD Ryzen desktop processor family, the AMD Ryzen™ 3 3100 and AMD Ryzen™ 3 3300X processors and AMD B550 Chipset for Socket AM4 designed for 3rd Gen AMD Ryzen desktop processors with over 60 designs in development.
Infineon – CIPOS™ Mini IM564-X6D
The IM564-X6D is a new 20 A CIPOS™ Mini PFC-integrated IPM that combines a single boost PFC and three-phase inverter in one package. The PFC integration into inverter IPM helps to reduce significant PCB area and simplify manufacturing process to reduce overall system cost.
Zajímavé videa


electronica—Leading the way to the All Electric Society


HRY, PC PŘÍSLUŠENSTVÍ A DALŠÍ


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Videoreportáž z veletrhu AMPER 2022

Firma týdne

Texas Instruments


Adresář


Texas Instruments

PULSIV


MikroElektronika d.o.o.

Cambridge GaN Devices


Traco Power

BALLUFF


Seica

PEI-Genesis


KEYENCE

CML Microcircuits


SAMTEC

ams-OSRAM


INTEL

TDK Corporation


Giada

RS group


NOKIA

ANRITSU


HARWIN

Digi-Key Electronics


AERS

Flex Power Modules


Danisense

BINDER


Parker Hannifin

MOXA


DANFOSS

Alliance Memory


Intelliconnect (Europe) Ltd.

KIOXIA Europe GmbH


Kalendář
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
embedded world 2025, Nuremberg, 11.–13.3.2025
AMPER 2025, Brno, CZ, 18.-20.3.2025
productronica China, Shanghai, 26.-28.3.2025
electronica China 2025, Shanghai, 15.-17.4.2025
electronica India 2025, Dehli, 17.-19.9.2025
SEMICON Europa, München, DE, 18.-21.11.2025
productronica 2025, München, DE, 18.-21.11.2025
electronica 2026, München, DE, 10.-13.11.2026

Interesting video
The ISS Design Challenge ...


Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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