Adresář
 

MOXA
 

DANFOSS
 

Alliance Memory
 

Intelliconnect (Europe) Ltd.
 

KIOXIA Europe GmbH
 

Antenova Ltd
 

Friedrich Lütze GmbH
 

Analog Devices
 

ASRock Industrial
 

NVIDIA
 

ECOM s.r.o.
 

Yamaichi Electronics USA Inc.
 

Laird Thermal Systems
 

HARTING
 

A.P.O. - ELMOS v.o.s.

29.11.2022 0:07:13
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DPI 750E
 
RS Components přidává řadu vylepšených i
SMI200
 
Nový pohled na klasiku: Kompaktní HMI s
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
Sada izolovaných klíčů BAHCO
s-Sense
 
Moduly s-Sense firmy R&D SOFTWARE SOLUTI
LP-RF
 
Panasonic: LP-RF – cenově dostupné laser
TH381
 
Miniaturní těsné svorky řady TH381
TP-1303
 
Dvoukanálové napájecí zdroje Twintex řad
AR236.B a AR232.B
 
Bezdrátové záznamníky AR236.B a AR232.B
JZ-500 a JZ-500-C
 
Kabely JZ-500 a JZ-500-C černé barvy fir

Elektronické součástky



Murata and Google team to develop world’s smallest AI module with Coral intelligence
Murata announces that it has created the world’s smallest artificial intelligence (AI) module in partnership with Google – the Coral Accelerator Module. The custom designed module packages Google’s Edge TPU ASIC within a miniaturized footprint.

Inductors: Compact dual inductors with high saturation current
TDK Corporation has extended its range of dual inductors to include the new EPCOS series B82477D6*. The seven series types cover an inductance range from 2 x 3.9 µH to 2 x 47 µH and are designed for maximum rated currents from 2.83 A to 7.05 A. A special feature of the inductors, which are certified according to AEC-Q200 and compatible with RoHS, are the high saturation currents of up to 16.1 A.

10th Gen Intel Core H-series Introduces the World’s Fastest Mobile Processor at 5.3 GHz
What’s New: Today, Intel breaks beyond the 5 GHz barrier for laptops with the launch of the 10th Gen Intel® Core™ H-series mobile processors. Headlined by the 10th Gen Intel Core i9-10980HK1 processor, the H-series delivers desktop-caliber performance that gamers and creators can take anywhere.

DINKLE BUS Housingsystem
In addition to the extremely compact housing widths of 12mm and 20mm DINKLE is now offering 40mm and 60mm versions for additional electronics installation space. The new standard widths offer sufficient space to accommodate capacitors, relays or other high electronic components on the PCB.

Ultra-tiny MOSFETs from Nexperia are 36% smaller with lowest RDS(on)
Nexperia has launched a range of MOSFETs in the ultra-small DFN0606 package for mobile and portable applications including wearables. The devices also offer the lowest RDS(on) for their size and employ the commonly used pitch of 0.35 mm to simplify PCB assembly processes.

An All-in-One Programmable Smart Sensor for Always-On Applications
For all those high-tech applications such as fitness tracking, step counting, indoor navigation and gesture recognition on your smart watch, smartphone or other mobile devices, all require ultra-low power, high performance smart sensors.

Power Integrations’ GaN Technology Increases Output Power of High-Efficiency Display PSUs to 75 W
Power Integrations announced that its InnoSwitch™3-MX isolated switcher IC family has been expanded with the addition of three new PowiGaN™ devices. As part of a chipset with Power Integrations’ InnoMux™ controller IC, the new switcher ICs now support display and appliance power supply applications with a continuous output power of up to 75 W without a heatsink.

AMD Expands 3rd Gen AMD Ryzen™ Desktop Processor Family, Unleashing Powerful “Zen 2” Core For The Mainstream
AMD announced the newest additions to the 3rd Gen AMD Ryzen desktop processor family, the AMD Ryzen™ 3 3100 and AMD Ryzen™ 3 3300X processors and AMD B550 Chipset for Socket AM4 designed for 3rd Gen AMD Ryzen desktop processors with over 60 designs in development.

Infineon – CIPOS™ Mini IM564-X6D
The IM564-X6D is a new 20 A CIPOS™ Mini PFC-integrated IPM that combines a single boost PFC and three-phase inverter in one package. The PFC integration into inverter IPM helps to reduce significant PCB area and simplify manufacturing process to reduce overall system cost.

Rugged enclosure for PIM testing in complex multi-band 4G and 5G networks
Foremost Electronics, the engineering-led Essex based importer and specialist distributor of electromechanical components, works closely with its global suppliers to provide bespoke solutions for its customers where standard products do not meet the needs of the end product.

New solar fuses offer higher amperage in a streamlined, single case design
Littelfuse announced today the expansion of its SPXI series in-line solar fuses to include 35 to 60 amperage models. Designed to integrate into in-line assemblies within a wire harness, these 1500 V DC solar fuses protect photovoltaic (PV) installations from overloads and short circuits to minimize damage to solar panels.

New DC-DC Converters Offer 50 Percent Smaller Footprint
Murata unveiled the MYW series from the MonoBK™ DC-DC converter family. The new point-of-load (POL) modules offer a 50-percent smaller footprint than competing solutions and set new standards in size, efficiency and performance.

Miniaturní těsné svorky řady TH381
Miniaturní těsné svorky řady TH381 firmy TECHNO jsou výjimečným spojením mnoha výhod. Vysoká těsnost (IP69K) a odolnost vůči podmínkám prostředí umožňují, aby se používaly v mnoha venkovních aplikacích, jako je pouliční osvětlení, osvětlení budov, fontán a reklamních poutačů.

AVX Ethertronics new LoRa Module ETH-LORA-M-AX-01
The Ethertronics® LoRa Module ETH-LORA-M-AX-01 is a SMT mounted radio module that operates in the unlicensed 868 MHz and 915 MHz bands.

Safety in cars: Infineon’s AURIX™ is the first embedded safety controller worldwide to be ASIL-D certified according to ISO 26262:2018

Těsná relé firmy Hongfa Relay
Automobilová relé s konfigurací kontaktů SPDT jsou určená pro montáž do patice. Vyznačují se odolností vůči prachu a vlhkosti. Verze je vybavená citlivou cívkou 12VDC a rezistorem tlumícím přepětí. Kontakty jsou pokryty slitinou AgSnO2 a mohou vést stejnoměrný proud 30 A (odporová zátěž). Relé HONGFA RELAY pracují při teplotě -40…+125°C.

Even greater number of mating cycles with the push-pull connector Y-Circ P with protection rating IP68
The waterproof T-series of the Y-Circ P push-pull circular connector family from Yamaichi Electronics has now been qualified for up to 5,000 mating cycles. In addition, the connectors are now available in size 09, 12, 15 and 18.

FLH Mini Sealed 2.50mm Connectors
Amphenol's FLH Series Mini Sealed 2.50mm pitch connectors provide a wire-to-wire IP67 sealing in mated conditions. Its compact and waterproof characteristics make it ideal for applications in rugged environments as well as industrial, lighting appliances, HVAC and smart home.


Zajímavé videa


PRŮMYSLOVÉ PŘEVODNÍKY TLAKU ZNAČKY CYNERGY3


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Intel Alder Lake Product Video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus

Firma týdne

MOXA


Adresář


MOXA


DANFOSS


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


ECOM s.r.o.


Yamaichi Electronics USA Inc.


Laird Thermal Systems


HARTING


A.P.O. - ELMOS v.o.s.


REM-Technik s.r.o.


MACH SYSTEMS s.r.o.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


INTEL


CODICO


akYtec GmbH


Future Electronics



Kalendář
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
AUTOMATICON 2023, 7.3.-9.3.2023, Warsaw, PL
AMPER 2023, 21.-23.3.2023, Praha, CZ
SMTconnect, 9.-11.5.2023, Nuremberg, DE
PCIM Europe, 9.-11.5.2023, Nuremberg, DE
sps Italia, 13.-15.5.2023, Fiere di Parma, IT
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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