Bezdrátová technologie WiLink 6.0 na vývojovém modulu OMAP35x
Společnost Texas Instruments integrovala bezdrátovou technologii WiLink 6.0 do vývojového modulu procesoru OMAP35x. Vývojáři tak mohou snadno vytvářet aplikace, která potřebují konektivitu standardu Bluetooth. Integrace kompletního řešení wireless LAN na jediném čipu WL1271 výrazně snižuje náklady na vývoj, jeho dobu a umožňuje maximální miniaturizaci zařízení.
One of the industry’s smallest solutions to integrate wireless LAN (WLAN) and Bluetooth® technologies in a single chip, the WL1271 solution sparks futuristic designs on the EVM through the powerful combination of TI’s OMAP™ processor and wireless connectivity. Through pre-integration and optimization, these technologies reduce design barriers for cutting-edge applications, accelerate development time, and open a new range of use cases.
More information: http://www.ti.com/35xEVMwWL1271-pr.
Designers today use the OMAP35x EVM, powered by a 720 MHz OMAP3530 processor, to deliver enhanced experiences such as Web browsing, optimized audio and video, and productivity tools like databases, spreadsheets, presentations, and e-mail. The WL1271 solution, shipping in volume today, extends these capabilities even further with the incorporation of Bluetooth technology, and seamless coexistence between WLAN and Bluetooth capabilities that ensures anytime, anywhere connections.
Key features and benefits of the OMAP35x EVM with the WL1271 solution:
- Pre-integration into the OMAP35x EVM hardware and software
- 802.11b/g/n & Bluetooth® 2.1+EDR support
- Linux operating system support, with plans for Windows® Embedded CE support in mid-2010
- Sparks out-of-the-box WLAN and Bluetooth® applications, like Web access and headset music
- Solves coexistence challenge
- Has undergone rigorous quality control and testing which speeds time to market
- Full community support speeds debugging and development cycles
- Continued support through Adeneo Embedded, LS Research (LSR), Mistral Solutions
“As our customers continue to lead the industry with revolutionary designs and products, and we are constantly seeking ways to help them meet evolving market needs with our market leading technologies,” said Doug Wilson, General Manager of TI’s Emerging Connectivity Solutions business. “As the first of many connectivity platforms that will be introduced to market, the incorporation of the WL1271 solution on the OMAP35x EVM delivers ubiquitous connectivity to the design board and echoes our commitment to customer success, while paving the way for tomorrow’s connected, portable devices.”
Strong partnerships for continued market support
TI announced extended software support from OMAP Developer Network members as well as enhanced community involvement. Support from Adeneo Embedded will give customers access to real-time development technologies to incorporate software and hardware solutions based on Windows® Embedded CE. “Adeneo Embedded and TI have worked together to bring Windows Embedded CE support to TI solutions,” said Yannick Chamming’s, CEO at Adeneo Embedded. “With the growing interest in connectivity, we are pleased to extend our collaboration with TI to include the WiLink 6.0 connectivity offering to bring new dimension of support to TI’s platforms.”
LSR will manufacture its “TiWi” connectivity module for the OMAP35x EVM. “LSR and TI have a long history of collaboration, putting market leading technologies into the hands of manufacturers,” said Bill Steinike, CEO at LSR. “With the need for connectivity solutions growing, the TiWi module based on TI’s WiLink 6.0 solution helps manufacturers integrate this feature set into their products faster than ever before."
Mistral Solutions collaborated with TI for the development of the OMAP35x EVM and has also developed the WL1271 daughter card for this offering. Mistral Solutions leverages its expertise with the OMAP35x platform towards helping customers to get their custom devices to market. “We are pleased to collaborate with TI as they address new markets with the WL1271 solution,” said Anees Ahmed, President and CEO of Mistral Solutions. “Working with TI, we will help product developers adapt these features in their end product design, giving them an edge over development costs and time in bringing out power optimized, feature rich devices into the market.”
Availability
Find out more about TI's OMAP3530 processor and OMAP35x EVM
201004061210.4.2010TelekomunikaceTexas Instruments