Adresář
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation
 

Giada
 

RS group
 

NOKIA
 

ANRITSU
 

HARWIN
 

Digi-Key Electronics

29.03.2024 0:07:15
bloky
maketa
HomePage
Elektronické součástky
Embedded
Automatizace průmyslu
Bezpečnost
Měřicí technika
Nářadí a pomůcky
Elektromobilita
Solární energie
Osvětlení
Zaměstnání
Veletrhy, výstavy, akce
Online akce
Zajímavé videa
Různé

Access Point WBE750
 
NETGEAR WBE750: nadupaný výkon a nepřeko
POLOLU-4980
 
MINIATURNÍ STEP-UP/STEP-DOWN MĚNIČE FIRM
MANSON SDP-2210
 
PROGRAMOVATELNÝ LABORATORNÍ NAPÁJECÍ ZDR
DPI 750E
 
RS Components přidává řadu vylepšených i
BHI260AB
 
An All-in-One Programmable Smart Sensor
SMI200
 
Nový pohled na klasiku: Kompaktní HMI s
BAHCO
 
Sada izolovaných klíčů BAHCO
s-Sense
 
Moduly s-Sense firmy R&D SOFTWARE SOLUTI
LP-RF
 
Panasonic: LP-RF – cenově dostupné laser
TH381
 
Miniaturní těsné svorky řady TH381

KEMET Extends KC-LINK™ Range Using KONNEKT™ High-Density Packaging Technology
Designed for use by power electronics engineers where high-power density and high efficiency in a small form factor is critical

KEMET Corporation continues to strengthen its power conversion solutions by extending its popular KC-LINK range using KONNEKT high-density packaging technology to meet the growing demand for fast-switching wide bandgap (WBG) semiconductors, EV/HEV, LLC resonant converters, and wireless charging applications. This technology combines KC-LINK’s robust and proprietary C0G Base Metal Electrode (BME) dielectric system with KONNEKT’s innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution well-suited for both high-density packaging and high-efficiency applications, producing up to four times the capacitance compared to a single multi-layer ceramic capacitor.

High mechanical robustness allows KC-LINK capacitors with KONNEKT to be mounted without the use of lead frames. This design provides extremely low effective series inductance (ESL), increasing the operating frequency range and allowing for further miniaturization. Available in commercial grade with tin termination finish, this series is Pb-Free, RoHS and REACH compliant. Capacitors utilizing KONNEKT technology have the unique ability to be mounted in a low-loss orientation to increase their power handling capability further. 

Combining KEMET’s revolutionary Class 1 C0G dielectric system with KONNEKT technology offers a low-loss, low-inductance package capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. Designed for an operating temperature range up to 150°C, the capacitor can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling. These components are positioned for growth within the DC/DC converter market in aerospace, medical and automotive applications. According to Business Insider*, the global DC-DC converter market is expected to grow at a CAGR of 17.5% from 2019 to 2025 and reach USD 22.4 billion by 2025. 

“The low ESR of KC-LINK capacitors results in best-in-class ripple current capability,” said Dr. John Bultitude, KEMET Vice President and Technical Fellow. “Combined with KONNEKT technology, this solution delivers thermal stability and mechanical robustness through increased efficiency by combining multiple capacitors into a single high density, ultra-low loss package.” 

KEMET’s KC-LINK range with KONNEKT technology is available immediately via KEMET distributors. To learn more about KC-LINK with KONNEKT technology capabilities and applications, visit kemet.com/konnekt

*Source: DC-DC Converter Market by Vertical, Form Factor, Product Type, Output Power, Input Voltage, Output Voltage, Sales Channel, Output Number and Region - Forecast to 2025, Business Insider, November 2019

2020060301 / 03.06.2020 / Elektronické součástky / KEMET /

KEMET Advances Its Latest Environmental Sensor Solutions for Industrial Applications
Pyroelectric passive infrared (PIR) sensors allow for easy integration, configuration and more design-in possibilities

KEMET Extends KC-LINK™ Range Using KONNEKT™ High-Density Packaging Technology
Designed for use by power electronics engineers where high-power density and high efficiency in a small form factor is critical

KEMET Introduces Metal Composite Power Inductors for Automotive Applications
METCOM™ for automotive offers high reliability and performance with best in class EMI shielding for low magnetic flux leakage

Zajímavé videa


HRY, PC PŘÍSLUŠENSTVÍ A DALŠÍ


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Videoreportáž z veletrhu AMPER 2022


AMPER 2023 - Představujeme vystavovatele... AERS s.r.o.

Firma týdne

BALLUFF


Adresář


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


HARWIN


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


MOXA


DANFOSS


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA



Kalendář
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813